Electromagnetic Material Interrogation Using Conductive Interfaces and Acoustic Wavefronts


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By H.T. Banks, M.W. Buksas, T. Lin
Imprint:
SIAM - SOCIETY FOR INDUSTRIAL AND APPLIED
Release Date:
Format:
HARDBACK
Dimensions:
228 x 151 mm
Weight:
500 g
Pages:
1559

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Description

Preface; 1. Introduction; 2. Introduction and physical modeling; 3. Wellposedness; 4. Computational methods for dielectrics with supraconductive boundary; 5. Computational methods for general polarization models; 6. Computational methods for acoustically backed dielectrics; 7. Concluding summary and remarks of potential applications; Bibliography; Index.

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